Advance Manufacturing Capabilities

  • Chip On Board (COB)
  • System In a Package (SIP)
  • Package on Package (POP)

Chip On Board (COB)

  • Interconnect customised ASIC chip to PCB
  • Incorporate Silicon, Polyamide, FR4 and Flex
  • MEMs Technology Process
  • From Die Size of 0.15mm
  • Wire-bonding:
    • Multi Tier
    • From Wire Size of 20µm
    • Wire Type of Gold or Aluminium
    • Precise Encapsulation High Accuracy

IC Assembly and Packaging

  • Incorporate customised design and circuitry
  • SIP customised transfer moulding
  • Customised Functional and In-Circuit testing