Corporate Mission

To be a responsible Global Contract Manufacturer with Dedicated and Motivated People providing Reliable and Quality Services at Competitive prices in the Electronics Industry.


THE GROUP PROVIDES A FULL RANGE OF SERVICES FROM:

  • Prototyping
  • SMT assembly for fine-pitch components such as micro-BGA, CSP, 01005 chip components
  • Flex-circuit assembly
  • IC Assembly and Packaging
  • Chip-on-Board assembly
  • Conformal coating of Printed Circuit assemblies
  • Box-Build assembly and
  • After-Market services
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