Advance Manufacturing Capabilities

• Chip On Board (COB)
• System In a Package (SIP)
• Package on Package (POP)

Chip On Board (COB)

• Interconnect customised ASIC chip to PCB
• Incorporate Silicon, Polyamide, FR4 and Flex
• MEMs Technology Process
• From Die Size of 0.15mm
• Wire-bonding:
• Multi Tier
• From Wire Size of 20µm
• Wire Type of Gold or Aluminium
• Precise Encapsulation High Accuracy

IC Assembly and Packaging

• Incorporate customised design and circuitry
• SIP customised transfer moulding
• Customised Functional and In-Circuit testing