SMT Process (RoHs Compliant) Capabilities up to:
- 01005 Chip Size
- 12 mils Integrated Circuit (IC) Pitch
- Micro Ball Grid Array (BGA) – Pitch 16 mils, >1000 Ball count
- Chip Scale Package (CSP) – Bump Diameter 0.132mm, Pitch 16 mils
- Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils, >500 Bumps
- Quad Flat Package (QFP) – Pitch 12 mils
- Chip On Board (COB)
Other Process (RoHs Compliant) Capabilities:
- Nitrogen Reflow
- Wave soldering
- Hot Bar Soldering
- Hot Bar Anisotropic Conductive Film (ACF)
- Selective conformal coating
Test & Analysis Capabilities up to:
- 3D X-Ray Imaging
- Automated Optical Inspection (AOI)
- Solder Paste Inspection (SPI)
- High Power Vision Systems 1000x magnification
- Solder Impurity Analysis
- In Circuit Testing
- Product Functional Testing
- Reliability Testing
